Flexible and intelligent microcooling systems on electronic printed circuit boards

The rapidly rising integration density and clock frequencies of the electronic components and the constantly growing number of functions leads to an integration density and cooling problem in the components on electronic printed circuit boards. This is demonstrated here with the example of transmission techniques in telecommunications. In the solutions applied today, those of integration density are exhausted and mechanically complicated. The difficulty of introducing and applying key components quickly, inexpensively and without the limitations of functionality requires an intelligent and flexible integration method and a new cooling concept like that which is described here.