Design of integrated systems including MEMS and ASICs

Design of products containing MEMS/MST subsystems requires a top-down approach to system design. We present a methodology to support the subsystem designers with behavioral models and simulation tools, which enable the specification of subsystem functions at the level of the system architect. 3-D multi-physics simulations are used to create the computationally efficient models required for system level simulations. The design methodology described here facilitates effective communication between the subsystem designers.