Study on the poly bump defect by TEM failure analysis

In this work we reported TEM failure analysis of an inline defect issue, nanosized poly bump defect formed during poly CVD process. Detailed TEM analysis was performed for the characterization of microstructure and composition of the nanosized defects by using various TEM FA techniques, including EDX, EELS analysis. It was found out that underneath the poly bump defect had a core-shell structure, i.e. oxide core with poly-Si shell. We demonstrated the importance of TEM sample preparation and the selection of suitable TEM FA techniques for the characterization of such nanosized defects for root-cause understanding.