Effects of ion-beam mixing on the performance and reliability of devices with self-aligned silicide structure

The uniformity of Ti silicide resistance has been greatly improved by using an ion-beam mixing technique. The integrity of both MOS capacitors and p-n junction diodes has been improved. N-channel MOS field-effect transistors fabricated with this technique show better electrical characteristics, less electron trapping in the gate oxide, and better hot-carrier resistance than with devices made without the use of ion-beam mixing.<
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