New encapsulation technique using standard DBC substrates technology

This paper describes an innovative encapsulation technique dedicated to power integrated converters, allowing reduction of the cost, volume, and weight of the converters. This technique, using diode and IGBT chips (75-100 A, 350 to 1200 V) brazed on an aluminium nitride substrate, improves the thermal performances by reducing the number of interfaces between the chips and the cooling liquid. Moreover, a modular assembly has been developed using pressed electrical contacts. A 30 kW three-phase inverter is made to demonstrate the feasibility of this new technique.