Numerical Study of Overheat Fault in Copper Wire Caused by Bad Contact Base on Multi-physics Coupling

It is of great significance to study heating mechanism of bad contact wire since its high risk of fire. This is a problem of multi-physics coupling, which refer to electric and temperature field. A numerical coupling model is introduced in this paper to describe the overheat fault caused by bad contact in HPDE insulated copper wire base on COMSOL Multiphysics software. The heating effect on the fatigue fracture surface is taken into account, which is affected by the current density, contact area, contact resistance and thermal expansion coefficient, etc.