Flip-chip-bonded, 8-wavelength AlGaInAs DFB laser array operable up to 70°C for silicon WDM interconnects

An 8-wavelength light source for silicon WDM transceiver was developed using an AlGaInAs DFB laser array integrated with tapered-SOA and precise flip-chip bonding technology. The device demonstrated high Si-waveguide-coupled output powers of >+2.3dBm/ch under 8-ch simultaneous operation at 70°C.