Effect of temperature cycling on reliability of flip chip solder joint

This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can effectively improve the thermal fatigue life of solder joints. The content of PbSn bumps in Sn has significant influence on the solder joint reliability.