LED array modules by new method micron bump bonding method

An LED (light-emitting diode) array module was developed by employing the micron bump bonding technique, in which electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light-setting insulating resin. The developed LED array module has a resolution of 400 DPI, and is constructed by face-down mounting of 54 LED chips and 54 driver LSIs on a glass substrate. These LED chips, which have an electrode pitch of 63.5 mu m, are disposed on the glass substrate at a pitch of 10 mu m. A dedicated bonder was developed for this assembling work.<
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