Carbon based Thermal Interface Material for high performance cooling applications

Currently, a variety of Thermal Interface Materials (TIMs) are required to meet specific requirements for various products with no single TIM meeting the needs for all CPU market segments. Surface treatments, reflow temperatures, mechanical load, performance targets all play a role in choosing a specific TIM. Based on the above multitude of conditions, it is desirable to find a universal TIM that would enable all the products across all markets. To meet these requirements and based on legacy data, efforts should focus on TIMs that (1) have high bulk conductivity (i.e. > 20 W/mK) and (2) do not have hard or brittle contact surfaces and 3) are reliable over the years of normal usage.