A Cu/low-/spl kappa/ dual damascene interconnect for high performance and low cost integrated circuits

Copper and a low dielectric constant (low-/spl kappa/) material have been successfully integrated in a dual damascene interconnect architecture. The low-/spl kappa/ material (/spl kappa/=2.2) was used as intra-level dielectric and inter-level dielectric, which has led to significant reduction in both intra-level and inter-level capacitance. In addition, low Cu wiring resistance and low Cu via resistance have been achieved in the dual damascene interconnect which offers process simplification and low cost.