Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations

Automotive electronic devices are exposed to substantially harsher thermo-mechanical loads compared to commercial consumer electronic products. As a consequence, solder joints carrying out the electrical interconnection between the components undergo deformation and degradation under thermal cycling, which can determine the lifetime of the electronic assembly in long term operation. In the past decade, lifetime prediction methods for solder joints based on finite element (FE) simulations are increasingly employed in the process of product design. However, constitutive FE models for solder alloys capable of describing their mechanical behavior at the relevant conditions of automotive applications are still not widely established. Here, we employ a unified viscoplastic material model initially proposed by Chaboche et al. in order to address the mechanical properties of an as-casted Sn-based solder alloy under a cyclic mechanical load. Extensive experimental investigations at temperatures from −40°C up to +150°C reveal a complex nonlinear interplay between hardening, recovery and thermally activated inelastic deformation processes in the material studied. We identified the necessary constitutive model terms and performed parameter calibration according to their specific functionality. A very good agreement between the numerical calculations and experimental data is achieved, which renders the constitutive model used a very promising approach for a wide use in FE simulations of lead-free solder alloys.