The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrate

Seven underfill formulations have been evaluated for fast-cure, fast-flow, and low-clearance flow applications in flip chip assemblies. The effect of different underfill ingredients on processing and reliability is discussed. It will be shown that at least one formulation has superior flow rate under a 30-/spl mu/m die than any currently available commercial underfill.