Some reliability aspects of high temperature ICs

There are many physical mechanisms that can disrupt electrical performance at high temperatures. These mechanisms need to be controlled or eliminated in order for the parts to operate reliably for extended periods of time. Four specific high temperature failure mechanisms are described in this paper. Two of these mechanisms relate to the package - leakage current and wire bond resistance; the other two involve the thin films on the integrated circuit tungsten electromigration and resistor stability.