Evaluation of chip temperature for multichip IGBT modules by using the thermo-sensitive electrical parameter (TSEP)

The thermo-sensitive electrical parameters (TSEPs) is often used for evaluating junction temperature of power semiconductor device due to its convenient and fast measurement. However, this method can not establish a temperature map inside a module with individual or multiple chips connected in parallel. A novel inverse method is proposed in this paper to obtain the temperature distribution for multiple chips by taking several measurements under different electrical conditions. Infrared (IR) measurements were also carried out for comparison.