A High Density 250 $^{\circ}{\rm C}$ Junction Temperature SiC Power Module Development

A high temperature wirebond-packaged phase-leg power module was designed, developed, and tested. Details of the layout, gate drive, and cooling system designs are described. Continuous power tests confirmed that the designed high-density power module can be successfully operated with 250
$^{\circ}{\rm C}$
junction temperature. The power module was further utilized in an all-SiC rectifier system that achieves a 2.78 kW/lb power density.