In-line defect detection metrology tool matching

This paper is a case study of our experience matching five darkfield defect detection tools (Inspex model 8530) used for both patterned and unpatterned wafers, in a 0.25 um and beyond development/production facility, producing both logic and memory technologies. Two of the systems were new tools and three were existing tools upgraded to identical capability. In this implementation, sensitivity, count reproducibility, defect position reproducibility, throughput, and recipe transfer from tool to tool were of major concern. This study discusses the degree of tool matching obtained as well as the lessons learned from the project approach and methodology.