Radiation Performance Enhancement of E-Band Antenna in Package

This paper presents an antenna-in-package (AiP) solution with embedded wafer Level ball grid array (eWLB) packaging technology. The primary antenna is realized in the redistribution layer of the eWLB package. It is composed of two patches driven by differential signals and supports seamless connection with differential output monolithic microwave integrated circuits in a compact package. A dielectric rod lens was designed to optimize the radiation performance of the whole package. The final lens has the dimensions 10 mm × 10 mm × 10.5 mm. Our measurements show that the whole package (chip+AiP) including the lens reaches 16-dBm effective isotropic radiated power for the frequency range from 71.4 to 81.7 GHz. The radiation beam is relatively symmetric for both the E- and H-plane. The proposed AiP solution has great potential for millimeter-wave applications.