Characterization of bonding interface prepared by room temperature bonding after flattening by thermal imprint process

We developed the room temperature bonding of Au film flattened by thermal imprint process. The Au film surfaces were flattened by thermal imprint process. As a result, the flattening process was effective in case of the low bonding load or rougher Au surface. And we also apply developed process to bonding of seal ring patterns fabricated by Au electroplating. The surface of Au film could be successfully flattened by the thermal imprint process. As a result, large bonding strength was obtained for seal ring patterns with a width of 100 μm.