Stacking of known good rebuilt wafers with Through Polymer Via based 3D interconnect application to high speed DDR3

Based on Wire free Die on Die disruptive technology (WDoD
^TM
), high density memories have been manufactured in a small form factor package size [1]. 3D-Plus process flow is very much focused on niche markets such as defense, industrial and medical applications. However a new integration scheme based on Through Polymer Via enables a turnkey solution for high volume manufacturing of 3D packages.