ZnO nanowires lift-off from silicon substrate embedded in flexible films

A novel lifting-off method of ZnO nanowires from Si substrate and embedded in flexible films have been proposed in this study. Compared with peeling-off method by polydimethyl- siloxane (PDMS), the embedded ZnO nanowires may suffer from external forces to change the dimension. The shape of ZnO nanowires remained almost unchanged after using the novel lifting-off process. Flexible films served as the secondary and flexible substrate after ZnO nanowires transferring from the Si substrate. The lift-off fabrication is a candidate for Si substrate recycling usage and for large area fabrication.