Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects

This research paper introduces a new modeling approach for different bundled CNT structures. Based on the arrangements of single- and multi-walled CNTs in bundle, two different structures of mixed CNT bundles (MCBs) are proposed. Performance in terms of propagation delay is compared between different bundled CNT structures by using a driver-interconnect-load (DIL) system. It has been observed that the overall reduction in delay is in the range of 22.33% to 56.87% for bundled MWCNT with respect to other CNT structures at global interconnect lengths.