Finite element analysis for solder ball failures in chip scale package

In this study, the failure mechanism of solder ball connect in chip scale packaging (CSP) utilizing wire-bonded ball grid array was elucidated using finite element analysis. The macro-micro-coupling technique was used in the current model. There exist two contributors to solder ball cracking: shear stress and warpage of the package. It was recognized that shear stress prevailed over warpage of the package in impact on solder ball cracking in the present type of CSP.