Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages

Crosstalk of picosecond pulses in bondwires for plastic packaging is analyzed using the full-wave method of moments (MoM) and the FFT algorithm, showing that the static crosstalk model of SPICE is inappropriate for the high-speed package design. Plastic packaging materials significantly increase bondwire crosstalk due to the mutual electromagnetic coupling enhanced by the dielectric and radiation effects.