Substrate impact on the thermal performance of tape automated bonding components

The results of thermally characterizing a 160-I/O (input/output) tape automated bonding (TAB) device are reported. A finite-element technique is used to understand and model the thermal processes of the TAB. A three-dimensional (3-D) computer model is developed and validated against experimental data obtained in a natural convection environment. The 3-D model's results indicate that the thermal processes associated with the TAB are not 2-D in nature. A substantial temperature variation is present across much of the device. Several carriers are modeled with the TAB device to determine their thermal effect on the device's thermal characteristics. Reducing the card's cross-section from a multilayer printed circuit board (PCB) to a board with no internal planes substantially impacts the power dissipation capabilities of the component. The use of a molded rather than an FR4 material in the card has a negligible effect on the thermal characteristics of the attached device due to their similar thermal conductivity.<
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