Resistive Switching Behavior of Partially Anodized Aluminum Thin Film at Elevated Temperatures

Resistive switching behavior of partially anodized aluminum thin film has been investigated at temperatures of 25
$^{\circ}\hbox{C}$
–250
$^{\circ}\hbox{C}$
. Both the reset and set voltages decrease with increasing temperature, showing Arrhenius-like dependence with small activation energies. The pulse voltage experiment also suggests that the conductive filament breaking/reconnection is easier to occur at a higher temperature. Some possible mechanisms for the phenomena are discussed. On the other hand, at elevated temperatures without continuous electric field applied, while the high-resistance state exhibits no significant change with time, the low-resistance state (LRS) shows a continuous degradation, and there is a sudden failure. The LRS failure time shows Arrhenius dependence with an activation energy of
$\sim$
1.3 eV, suggesting that the LRS failure could be due to the migration of the excess Al atoms at high temperatures.