High frequency package design technology using S parameter synthesize method

Semiconductor technology has made significant advancements in the telecommunication market in the past few years. There are considerable and increasing demands for higher frequency application, such as for digital cellular phone systems, Personal Handy Phone System (PHS), wireless LAN systems and other mobile communication applications. Therefore, the synthesis of RF signals with low noise loss characteristics becomes important . The market requirements demands that the package or functional substrate also be smaller, has a lower cost and a higher performance. In order to satisfy these market demands, improvements in the size, electrical characteristics, reliability, and cost improvements for high frequency package design technology is necessary. Techniques using equivalent circuits have been popular in the design of high frequency circuits in the past. However, the applicable frequency band is very narrow and limited, particularly in the GHz frequency range. Modeling by equivalent circuits is very complicated, cumbersome, and too difficult to incorporate. Inevitably, the need for adjustment, which requires a large amount of time and labor, is very difficult to efficiently perform the high frequency circuit designs in the GHz range. Using S parameter techniques for high frequency range parameters synthesized in the several tens of giga hertz bands (microwave regions), a method has been developed which can predict the performance characteristics. This method can be applied as a basic design technique.