Study and modeling of interconnection in high-speed circuit

Since interconnection has become an essential component in high-speed integrated circuits (IC), it is of great importance to explore and investigate its electrical characteristics. This paper is summarized our recent work on high-speed interconnection in both 2D planar IC and 3D IC. First, we have build up distributed circuit model for differential microstrip line and vias system, then crosstalk of non-parallel transmission line has been studied and reduced with the using of serpentine guard trace; Second, we have explored the electrical characteristics of through silicon via (TSV).