Study on thermal boundary conductance between diamond and amorphous carbon

Thermal boundary conductance at the interface of diamond-amorphous carbon has been calculated using non-equilibrium molecular dynamic simulation. In particular, we describe the effect of solid stiffness, which associated with sp³ hybridization ratio of amorphous carbon, on thermal boundary conductance. The result shows that by increasing the sp³ hybridization ratio of amorphous carbon, thermal boundary conductance between diamond and amorphous carbon increases.