New circuit model for modeling differential pair of through-hole vias in multilayered electronic packages

A new equivalent circuit model is presented for modeling a differential pair of through-hole vias in multilayered electronic packages. The differential pair of through-hole vias, which share same anti-pad clearance, is analyzed and an equivalent circuit model for the differential vias is analytically derived from the electro- and magneto-quasi-static relations of the E and H fields along with the intrinsic via circuit model. The proposed circuit model is numerically validated and integrated to a systematic analysis of microwave network approach for power and signal integrity simulation in multilayered electronic packages.