Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC

In this paper, a monolithic integration structure with TSV interconnections is introduced for un-cooled infrared FPA to do easy wafer-level-package. Firstly, the challenging process for making the structure will be reviewed and identified. And then process sequence for making the TSV interconnections and RDLs and CMOS compatible surface process for IR FPA will be developed. In the end, a WLP scheme will be developed to show the benefit of easy WLP.