Comparison between electromagnetic and thermal stress induced by Direct Current flow in IGBT bond wires

This study is focused on the IGBT wire bond behaviour. We apply a direct current flow within the wire to reproduce the thermal cycling test used in reliability studies. On one hand we compare the temperature distribution between 3D FEM simulation and the experimental temperature measurement. We also point out the Von-Mises stress obtained. On the other hand we compare the thermo-mechanical results to those obtained with a 1D simplified thermal model. We also take into account the electromagnetic force and the mechanical stress that could be induced on the bond wire. Some experimental and simulation results are given.