Study on thermal conductive adhesives for high-power LEDs packaging

Direct bonded copper (DBC) as heat spreader and highly thermal conductive adhesives as thermal interface materials (TIMs), the light performances of packaged high-brightness light-emitting diodes (HB-LEDs) were tested. The results indicated that the light output power of LED modules increased with the thermal conductivities of TIMs. Apart from its low bulk thermal resistance, highly thermal conductive adhesive has high adhesion with adjacent substrates which resulted in low contact thermal resistance, then the optical performance and reliability of LED package can be improved.