Megasonic — Enhanced development for photolithography yield improvement

MEMS-specific processes have had to adapt standard IC manufacturing technologies in order to accommodate its custom requirements. Photolithography is one of the standard techniques which had to adopt the use of thick resists (between few tens and up to few hundreds of μm) needed for high aspect ratio features fabrication, and to adapt to the specific high volume manufacturing yield requirements demanded by developing new processing techniques. This paper introduces a new development technique based on the use of a megasonic transducer for yield improvement and process time reduction.