Parasitics consideration of layout design within IGBT module

To keep stray inductance low is a basic requirement in package design of IGBT modules. Meanwhile, paralleling of several switches is unavoidable in modern power electronics to insure always increasing current levels. Current balance between paralleled chips is another concern. In this paper, a simple power module, several different types of IGBT chips are respectively associated to reach the classical 400 A. After the extraction of the module parasitics, mainly the stray inductance, a study is performed to characterize the switching behavior for the two different power module layout cases.