Thermal and thermo-mechanical behavior of silicon platform with direct lead attachment

Miniaturization, low cost, and high performance are the trends in optical data link device packaging markets. Low cost, miniaturization, and high performance are achieved by reduction in the number of piece parts, process and assembly steps by populating the platform directly with piece parts without compromising package performance. Performance is a function of the packaging material. Maximizing the heat dissipation in the package (T/sub j//spl les/T/sub jmax/and T/sub jmin/