New packaging system and materials for FPAC

The characteristics demanded of the packages are being diversified; from the anti-popcorn package that was always the main problem in the past 10 years to improving on the package size towards a smaller and thinner size, for example CSP (Chip size package), other concerns being productivity, thermal management and environmental measures. We propose FPAC (Foil covered PACkage) as a packaging technology which can satisfy such requirements. We are also developing the production process and the material which makes this package. FPAC technology can be used to make the package of the thin type, with the high heat dissipation, and high humidity reliability. The process itself is easy with less amount of trash. We report on the current state about this development in this paper.