Packaging of emerging optical interconnection technologies in telecom platforms

Emerging optical interconnection technologies offer both new capabilities and packaging challenges for the system designer. These emerging technologies include parallel optics, high bandwidth plastic optical fiber, and new VCSELs which cover an increasing range of wavelengths. Parallel optics offers low cost interconnection with perhaps the best use of backplane space. Plastic optical fiber (POF) has been demonstrated with high bandwidths above 1 GHz/spl middot/km and low loss between 850 nm and 1300 nm. VCSELs will soon be available over a range of wavelengths spanning the spectrum from at least 650 nm to at least 1300 nm. Never before have systems designers of computing and telecommunication systems had so many choices for optical interconnection and different packaging approaches. Goals for packaging may include the ability to make very small systems, the ability to distribute systems to solve thermal problems, achieving good fiber management, getting the most bandwidth on and off and printed wiring board at the least use of space and the least disruption of backplane routine area, being able to insert boards having both optical and electrical interconnects without manual intervention with connectors, and the ability to flexibly manage heat dissipation in a system and on circuit boards. These goals will be discussed in terms of emerging technologies.