Application of copper-Carbon Nanotubes composite in packaging interconnects

This paper concentrates on the work done on utilizing Carbon Nanotubes (CNTs) for Electronic Packaging. CNTs have been utilized in various aspects of Electronic Packaging, for instance in solder joints, as filler materials for copper-CNT composites and CNTs themselves to replace copper for future interconnect technology. This paper also discusses the fabrication of copper-CNT composite.