In-situ measuring material parameters of a MEMS thin-film with a center-anchored circular plate by non-contact method

Research in mechanical characteristics and material parameters of MEMS thin-films is significant to the MEMS device. In-situ measuring these parameters such as Young's modulus and stress gradient is essential to promote the performance of MEMS device. A center-anchored circular plate adopted as the test structure which is used to in-situ measure the material parameters of MEMS thin-films by a non-contact method has been present here. The advantages have been arranged. The influence to the resonance frequency with different dimensions of the anchor also has been studied.