Input/Output Pad for Direct Contact and Contactless Testing

Non-contact probing can provide an important contribution for testing complex Systems-on-a-Chip (SoC), Systems-in-a-Package (SiP) and Through-Silicon-Vias (TSV) interconnections. This paper demonstrates the feasibility of wireless testing by capacitive coupling between a cantilever probe card and a pad. In particular a scheme of an I/O pad suitable for both contact and contactless probing is proposed.