Analysis of heat and fluid flow in a PCB channel using KAICUBE/Hanbit-1 parallel computer

A 3D analysis code for mixed convection flow through the printed circuit board (PCB) channel on which heat-generating chip modules are mounted has been developed. For uniformly distributed modules, a small domain containing a single module is considered with periodic and symmetric boundary conditions. Calculations have been made for various Grashof numbers to examine the effects of natural convection for both adiabatic and conducting wall conditions. The program is designed to run on the KAICUBE/Hanbit-1 parallel computer, and its performance on different machines is compared in this paper.