Design acceleration of embedded RF inductors on a multilayer flip chip package substrate

The electrical performance and the design challenges associated with radio frequency inductors on advanced multilayer package substrates are evaluated. First, new macro-models are developed and can be used to optimize the performance of RF components under process design rules constraints. Then, a novel scalable compact model that utilizes only frequency independent RLC components is introduced. This model is able to represent non linear frequency dependent effects such as skin effect and internal inductance. This compact model is validated using on-package measurements and also used to design a simple RF low pass filter.