Analyzing the mechanical strengths of SMT attached solder joints

Analytic approaches to the pull strength and the shear strength of SMT (surface mount technology) attached solder joints are studied by mathematical models. The predicted pull/shear strength of leaded ceramic quad packages was correlated with the experimentally measured data. The predictive models have been used for defining the design guidelines for selecting the optimum lead/pad configurations, the minimum solder volume, and the maximum component misalignment for fine-pitch SMT assemblies.<
>