Low stress silver-glass die attach materials

The influence of sintering and rheological properties on the performance of silver-glass die attach materials is described. Improved silver-glass material has been developed. Stress relief for large-area dice gives void- and crack-free die bonding. This is achieved by controlling the sintering rate via additive technology. Precise rheology for high-speed dispensing in a tight cavity is possible by implementing the Y, E, and n rheological criteria in the manufacturing control. Single-pass firing with no predrying for large area dice (500 mils or larger) is possible.<
>