Applying yield impact models as a first pass in upgrade decisions [semiconductor manufacturing]

As a semiconductor manufacturing leader, AMD fully utilizes all available defect inspection technologies to maintain a comprehensive dynamic yield management program. By obtaining, filtering and finally correlating all defect information AMD has been able to develop yield impact ratios for all commonly identified particles. These impact ratios are then combined to form a yield model used in predicting fab die per wafer (DPW) levels. The focus of this report is on the application of the yield model, and impact ratios used to determine whether it is cost effective to upgrade equipment. Applications illustrating the incorporation of various devices, volumes and technologies are looked at in putting together generic formula guidelines.