Microriveting-a new wafer joining method

Microriveting, a new technique to join wafers, is presented as an alternative to wafer bonding. Actual microrivets are fabricated to provide proof-of-concept structures and have been tested to confirm the feasibility of the idea for MEMS packaging. The microrivets of this paper are developed by nickel electroplating. Advantages of this technique include the joining process performed at room temperature and low voltage and relaxed requirements for surface preparation. Wafers of different sizes have been joined together by riveting and did not separate at large (macro) forces applied by rough handling and even by wafer sawing. Failure mechanisms of these rivets are investigated, and measurements are carried out to determine the joining strength under shear and tension. Results show that microriveting is a feasible and economical joining technique to package microdevices.