Materials issues for solutions of Power Electronic Building Blocks (PEBB)

This paper outlines a Power Electronic Building Block (PEBB) module design strategy which extends multichip module concepts to power electronics applications. This strategy provides two power signal layers as well as the capability to include a number of control layers, within the ceramic substrate between the two power layers. In addition, wirebonds with their associated limitations are eliminated through the use of direct metal attachment to the power devices.