A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure

A family of high performance MCM-C/D packages which are used in the new IBM S390 Enterprise G3 and Multiprise systems is described. The packages are constructed of a shielded thin film redistribution structure on a multilayer cofired alumina/molybdenum pinned substrate. Two sizes are described supporting up to 34 CMOS ASIC chips with high signal counts along with other components. The G3 MCM is hermetically sealed while the MP MCM is nonhermetic. Both packages are qualified for 100 K power on hours and 2500 field on/off cycles.