Nanostructured c-post wicks for advanced heat pipes

Micro-heat pipes incorporating advanced wicks are promising for the thermal management of high power density semiconductor and MEMS devices. We report experimental characterization of the heat transfer performance of wicks consisting of dense arrays of superhydrophilic Cu micropost wicks fabricated using electrochemical deposition and controlled chemical oxidation. A very high heat removal capability (as high as 800 W/cm
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with less than 35°C wick superheat) is demonstrated using 2×2 mm
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thin-film heaters as heat sources. Superhydrophilic CuO nanostructures integrated onto the micropost surfaces are shown to enhance the critical heat flux by as much as 70%.